ThinFlex-A double sided copper coated laminate without adhesive (halogen free)

ThinFlex-A is a double-sided metal-coated polyimide film without adhesive, supplied as a laminate with RA or ED copper on both sides. ThinFlex-A adhesive-free laminates are designed for a wide range of flexible circuit applications requiring advanced material performance, temperature resistance and high reliability.

Copper clad laminate without ThinFlex-H adhesive (halogen free)

ThinFlex-H is a metallized polyimide film without adhesive, supplied as a laminate with RA or ED copper plated on one side. ThinFlex-H adhesive-free laminates are designed for a wide range of flexible circuit applications requiring advanced material performance, temperature resistance and high reliability.

Halogen Free ThinFlex-Q Coverlay

ThinFlex-Q is a polyimide film composite coated on one side with a flame retardant, modified halogen free epoxy adhesive. The coverlay can be used in the manufacture of flexible printed circuit boards to protect and isolate circuits.