ThinFlex: High-Performance Flexible Laminates

Global Technology SA offers its customers ThinFlex, a line of high-quality flexible laminates designed to meet the requirements of advanced applications in the flexible printed circuit industry, ensuring excellent performance, high reliability, and resistance to elevated temperatures.

ThinFlex-A: Double-Sided Adhesive-Free Copper-Clad Polyimide Laminate (Halogen-Free)

ThinFlex-A is an adhesive-free, halogen-free laminate consisting of a polyimide film clad with RA or ED copper on both sides. Designed for a wide range of flexible circuit applications, it provides superior dimensional stability, thermal resistance, and long-term reliability.

ThinFlex-H: Single-Sided Adhesive-Free Copper-Clad Polyimide Laminate (Halogen-Free)

ThinFlex-H is an adhesive-free, halogen-free laminate featuring a polyimide film clad with RA or ED copper on one side. Ideal for flexible printed circuit applications requiring high-performance materials, this laminate ensures excellent thermal resistance, flexibility, and reliable performance under demanding operating conditions.

ThinFlex-Q: Halogen-Free Flexible Coverlay

ThinFlex-Q is a polyimide-based composite with a single-sided, halogen-free, flame-retardant epoxy adhesive layer, designed for use as a coverlay in flexible printed circuit manufacturing. This material provides effective circuit protection and insulation, ensuring electrical and mechanical integrity in flexible devices.

With the ThinFlex range, Global Technology SA supports its customers with state-of-the-art flexible materials, enhancing production processes and adding value to every project.

Technical Data Sheets (TDS) for ThinFlex products are available upon request. Contact us to discover how ThinFlex laminates can optimize your production and support the development of next-generation flexible electronic solutions.