ThinFlex-A double-sided copper-coated laminate without adhesive (halogen-free)
ThinFlex-A is a double-sided metal coated polyimide film without adhesive, supplied in the form of laminate with RA or ED copper on both sides. ThinFlex-A adhesive-free composites are designed for a wide variety of flexible circuit applications requiring advanced material performance, temperature resistance and high reliability.

Copper-coated laminate without ThinFlex-H adhesive (halogen-free)
ThinFlex-H is a metal coated polyimide film without adhesive, supplied in the form of laminate laminated with RA or ED copper on one side. ThinFlex-H adhesive-free composites are designed for a wide variety of flexible circuit applications requiring advanced material performance, temperature resistance and high reliability.

Coverlay halogen-free ThinFlex-Q
ThinFlex-Q is a polyimide film composite coated on one side with epoxy adhesive, flame retardant, free of modified halogens. Coverlay can be used in the manufacture of flexible printed circuit boards for the protection and isolation of circuits.