SOLUTIONS FOR THE PCB INDUSTRY
ThinFlex flexible laminates
Copper-clad polyimide and coverlay for flexible circuits, selected according to construction, flexing and thermal conditions.
Selection criteria
Circuit construction
Copper-clad polyimide and coverlay for flexible circuits, selected according to construction, flexing and thermal conditions.
Flexing behaviour
Copper-clad polyimide and coverlay for flexible circuits, selected according to construction, flexing and thermal conditions.
Thermal compatibility
Copper-clad polyimide and coverlay for flexible circuits, selected according to construction, flexing and thermal conditions.
Information for the assessment
- Structure and number of sides
- Polyimide and copper thicknesses
- Static or dynamic flexing
- Temperature and process
Technical documentation
Need help identifying the right solution?
Describe the application, process and objective. The assistant collects the initial requirements and prepares the request for the Global Technology team.