Multilayer stackup builder

How the stackup builder works

The stackup builder lets you build a multilayer board layer by layer from FR-4 cores and prepregs and see the cross-section drawn to scale as you go. Choose the number of layers (4 to 16), the material (standard Tg unfilled FR-4, high Tg filled FR-4 or a low-loss resin system), the outer copper foil, the plating, the target thickness with its tolerance and the solder mask. You can start from a ready-made build, mirror the top half and read thicknesses in mil.

The tool compares the pressed, finished and with-mask thickness against your target and prepares a printable build sheet. It is the first step of the PCB tools chain: the build passes automatically to the tool selector and then to the drilling advisor.

Frequently asked questions

Where do the prepreg thicknesses come from?

Prepreg thickness and Dk are estimates calculated from the IPC-4412 glass weight of each style, the resin content and a typical resin density for the material class. They are not the data of any specific laminate brand, and Dk values are approximate.

How is inner copper taken into account?

Prepreg gaps lose the resin that fills the adjacent inner copper: the tool subtracts copper thickness × (1 − copper coverage).

Can I use the result for production?

The result is for guidance only, without warranty: always confirm a build against the laminate supplier’s datasheet and the fabricator’s press data. Send us your stackup and we will check it against the material supplier’s values: contact us.