MATERIALS FOR THE PCB INDUSTRY
Base materials for printed circuit boards
Rigid, multilayer and flexible laminates together with electrodeposited copper foil: one technical path for selecting materials around the design and manufacturing process.
Three families, one coherent selection
ThinFlex flexible laminates
Copper-clad polyimide and coverlay for flexible circuits.
Explore the families →Rigid and multilayer laminates
Cores and prepregs for standard and advanced PCB constructions.
Explore the families →Circuit Foil copper foil
Electrodeposited foil for PCB, HDI and high-performance applications.
Explore the families →Selection starts with requirements
Electrical performance, thermal behaviour, mechanical construction and manufacturing compatibility must be assessed together.
Information for the assessment
- Construction, layer count and application
- Dielectric and copper thicknesses
- Electrical and thermal requirements
- Static or dynamic flexing
- Process, finish and volumes
Selected technical documentation
VT-42
Open document →VT-481
Open document →ThinFlex A
Open document →ThinFlex H
Open document →Circuit Foil Product Catalogue
Open document →Which material does your project need?
Describe construction, thicknesses, electrical and thermal requirements. The assistant gathers the initial information and prepares the request for the Global Technology team.
Contact the team