Rigid and multilayer laminates
Cores and prepregs for standard and advanced PCB constructions, assessed against thermal, electrical and manufacturing requirements.
Selection criteria
Thermal reliability
Cores and prepregs for standard and advanced PCB constructions, assessed against thermal, electrical and manufacturing requirements.
Electrical performance
Cores and prepregs for standard and advanced PCB constructions, assessed against thermal, electrical and manufacturing requirements.
Manufacturing compatibility
Cores and prepregs for standard and advanced PCB constructions, assessed against thermal, electrical and manufacturing requirements.
Information for the assessment
- Construction and layer count
- Core, prepreg and copper thicknesses
- Thermal and electrical requirements
- Assembly process and volumes
Documentation
VT-42
VT-481
VT-47 V2
VT-901
VT-4B3
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Range
Indicative values from the available technical data sheets. Always check the current TDS before final selection.
| Material | Type | Indicative Tg | Application | Data sheet |
|---|---|---|---|---|
| VT-42 | Standard FR-4 | 140 °C | Standard rigid and multilayer constructions | TDS → |
| VT-481 | Lead-free FR-4 | 150 °C | Lead-free assemblies | TDS → |
| VT-47 | Low-CTE filled FR-4 | 180 °C | High-Tg multilayers | TDS → |
| VT-901 | Polyimide | 250 °C (TMA) | Applications requiring high thermal performance | TDS → |
| VT-4B3 | Metal-based laminate | 130 °C (DSC) | IMS applications and thermal management | TDS → |