PCB DEFECT DIAGNOSIS

Smear

Problem → causes → verification → initial corrective action. Preliminary guidance to be validated on the actual process.

Problem

Smear

Excessive heat, insufficient chip evacuation, a worn tool or an unsuitable cycle.

Inspect the microsection, hole wall, resin and defect distribution through the stack.

Reduce heat input, improve evacuation, and verify retraction, tool condition and desmear.